{"id":468,"date":"2025-03-13T16:57:39","date_gmt":"2025-03-13T16:57:39","guid":{"rendered":"https:\/\/advaluetech.com\/adtest\/?page_id=468"},"modified":"2025-08-14T21:57:39","modified_gmt":"2025-08-14T21:57:39","slug":"viapaste","status":"publish","type":"page","link":"https:\/\/advaluetech.com\/adtest\/viapaste","title":{"rendered":"Via Filling Paste"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\">The via filling paste was developed for use on AlN and Al<sub>2<\/sub>O<sub>3<\/sub>&nbsp;substrates.<\/p>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n<style>.acf-product-sub-details .psb-card{ flex: 0 1 calc(100% - 20px); } .acf-product-sub-details { margin-bottom: 20px; }<\/style><div class=\"acf-product-sub-details\"><div class=\"psb-card\"><div class=\"psb-card-inner\"><h5 class=\"psb-name\">FK1105<\/h5><p class=\"psb-desc\">The AgPt via filling paste FK1105 is specified for use on \u201cAN180\u201d AlN substrates, by CoorsTek (formerly ANCeram), and \u201cRubalit 7085\u201d Al<sub>2<\/sub>O<sub>3<\/sub> substrates, by CeramTec. Substrates with other surface qualities or from other manufactures may lead to variations in the results. The paste exhibits very little sinter shrinkage in order to fill the via as completely as possible. This helps to establish contact between buried and surface mentalizations of multi-layer ceramics.<\/p><\/div><\/div><div class=\"psb-card\"><div class=\"psb-card-inner\"><h5 class=\"psb-name\">Stencil printing<\/h5><p class=\"psb-desc\">The paste can be used for the metallization of vias in aluminum nitride and alumina. To fill the vias as fully as possible, stainless steel stencils should be used which are adapted to fit the thickness of the substrates. With regard to the via openings in the stencils, Fraunhofer IKTS recommends making the opening approx. One to five percent wider than the via diameters introduced in the ceramics.<\/p><\/div><\/div><\/div>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Paste Properties<\/h2>\n\n\n<div class=\"acf-technical-specs-wrapper\"><table class=\"acf-table\"  border=\"1\"><thead><tr><th>Characteristics<\/th><th>Unit<\/th><th>FK1105<\/th><\/tr><\/thead><tbody><tr><td>Material<\/td><td>--<\/td><td>AgPt<\/td><\/tr><tr><td>Viscosity<sup>1<\/sup><\/td><td>Pa\u00b7S<\/td><td>TBD<\/td><\/tr><tr><td>Sheet resistance<sup>2,6<\/sup><\/td><td>mOhm\/Sq<\/td><td>\u226410<\/td><\/tr><tr><td>Solderability<sup>3,6<\/sup><\/td><td>%<\/td><td>TBD<\/td><\/tr><tr><td>Leaching resistance<sup>4,6<\/sup><\/td><td>Dips<\/td><td>TBD<\/td><\/tr><tr><td>Adhesion<sup>5<\/sup>(number offirings)<\/td><td><\/td><td><\/td><\/tr><tr><td>-Initial(1X)<sup>6<\/sup><\/td><td rowspan=\"2\">N\/4mm\u00b2<\/td><td>TBD<\/td><\/tr><tr><td>-Aged(1X)<sup>6<\/sup><\/td><td>TBD<\/td><\/tr><tr><td>Fired film thickness<\/td><td>\u00b5m<\/td><td>15\u00b11<\/td><\/tr><tr><td>Coverage<sup>7<\/sup><\/td><td>cm\u00b2\/g<\/td><td>63\u00b15<\/td><\/tr><\/tbody><\/table><\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><em>&#8211;from Fraunhofer IKTS<\/em><\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><em><em>All other specifications correspond to the general process conditions.<\/em><\/em><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><em>Brookfield viscometer HB with spindle\/cup combination SC4-14\/-6RP(Y) at n=10 rpm and 25\u00b10.2\u00b0C.<\/em><\/li>\n\n\n\n<li><em>Sheet resistance, calculated for a fired thickness of 15\u00b11 \u00b5m.<\/em><\/li>\n\n\n\n<li><em>Solder Sn\/Pb\/Ag 63\/35.5\/1.5; flux: Alpha 611, soldering time: 5 s, soldering temperature: 220\u00b12\u00b0C.<\/em><\/li>\n\n\n\n<li><em>Solder Sn\/Pb\/Ag 63\/35.5\/1.5; flux: Alpha 611, soldering time: 5 s, soldering temperature: 230\u00b12\u00b0C.<\/em><\/li>\n\n\n\n<li><em>90\u00b0 wire peel test in accordance with DlN 41850-2, 2\u00d72 mm2 pad size, solder: Sn\/Pb\/Ag 63\/35.5\/1.5, artificial aging time 100 h at 150\u00b0C.<\/em><\/li>\n\n\n\n<li><em>Firing profile: total cycle time 30 min, 10 min at 850\u00b0C.<\/em><\/li>\n\n\n\n<li><em>Calculated area that can be printed with one gram paste in the recommended thickness.<\/em><\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>The via filling paste was developed for use on AlN and Al2O3&nbsp;substrates. Paste Properties &#8211;from Fraunhofer IKTS All other specifications correspond to the general process conditions.<\/p>\n","protected":false},"author":13,"featured_media":7063,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_breakdance_hide_in_design_set":false,"_breakdance_tags":"","footnotes":""},"class_list":["post-468","page","type-page","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Via Filling Paste | AdValue Technology<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/advaluetech.com\/adtest\/viapaste\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Via Filling Paste | AdValue Technology\" \/>\n<meta property=\"og:description\" content=\"The via filling paste was developed for use on AlN and Al2O3&nbsp;substrates. 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