Conductor Pastes
Various conductor pastes are available for contacting resistors and applying conductor lines on AlN. Each paste possess specific properties, such as electrical conductivity, solderability, leaching resistance and adhesion. This variety of options allows our customers to select pastes that are tailored to their intended use and specific requirements.
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FK1071
Thick films produced with FK1071, an AgPt
conductor paste, are characterized by their low
film resistance and good solderability. It allows to
produce thick-film conductors for AlN with a low
resistance.
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FK1205
With FK1205, a conductor paste with AgPd
contained in a 3:1 ratio, the fired films provide
excellent leaching resistance and solderability.
FK1205 can be used as a conductor paste for the
FK9600 and FK9900M paste systems.
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FK1282
The fired films of FK1282, an AgPt conductor
paste, are characterized by excellent leaching
resistance and solderability.
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FK1572
With FK1572, an Ag conductor paste, it is
possible to cost-efficiently produce films with
very low surface resistance below 3.5 mOhm/Sq.
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FK1574
The fired films of FK1574, an AgPtPd conductor
paste, provide excellent leaching resistance and
solderability, in particular with regard to lead-
free solder
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FK1916
With FK1916, a conductor paste with AgPd
contained in a 6:1 ratio, it is possible to produce
films with high solderability, leaching resistance
and adhesion. The paste can be used as a
conductor paste for the FK9600 and FK9900M
paste systems.
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FK1953
The fired films of FK1953, a conductor paste with
an AgPd ratio of a 3:1, provide excellent leaching
resistance and solderability. The paste is the
RoHS II and REACH compliant successor of
FK1220 and is a suitable conductor paste for the
FK9600 and FK9900M resistor paste system.
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FK3101
The copper paste FK3101 can be used on Al 2 O 3
and pre-oxidized AlN substrates, as well as on
non- pre-oxidized AlN ceramics which have
previously been thinly metalized with FK3201, in
order to produce films with up to 300 µm height.
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FK3201
The copper paste FK3201 is suitable for
application on Al 2 O 3, as well as on non- pre-
oxidized AlN ceramics.
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Technical specifications
| Characteristics | Unit | FK1572 | FK1071 | FK1916 | FK1205 | FK1953 | FK1282 | FK1574 | FK3101 | FK3102 |
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| Material | -- | Ag | AgPt | AgPd | AgPd | AgPd | AgPt | AgPtPd | Cu | Cu |
| Alloy ratio | -- | -- | 97:3 | 6:1 | 3:1 | 3:1 | 3:1 | 13:3:1 | -- | -- |
| Viscosity | Pa·S | 140...220 | 320…450 | 180…350 | 180…350 | 150…350 | 180…350 | 180…350 | TBD | TBD |
| Sheet resistance | mOhm/Sq | ≤3.5 | ≤6 | ≤15 | ≤25 | ≤25 | ≤35 | ≤60 | TBD | TBD |
| Solderability | % | -- | ≥95 | ≥95 | ≥98 | ≥90 | ≥95 | ≥90 | ≥90 | ≥90 |
| Leaching resistance | Dips/result | -- | ≥3 | ≥3 | ≥3 | ≥3 | excellent | excellent | TBD | TBD |
| Adhesion(number offirings) | ||||||||||
| -Initial(1X) | N/4mm² | -- | ≥16 | ≥28 | ≥28 | ≥30 | ≥30 | ≥28 | TBD | TBD |
| -Aged(1X) | -- | ≥16 | ≥18 | ≥18 | ≥22 | ≥22 | ≥22 | TBD | TBD | |
| -Initial(3X) | -- | ≥22 | ≥22 | ≥30 | ≥20 | ≥27 | -- | -- | ||
| -Aged(3X) | -- | ≥16 | ≥16 | ≥21 | ≥18 | ≥19 | -- | -- | ||
| Fired film thickness | µm | 15±1 | 15±1 | 15±1 | 15±1 | 15±1 | 15±1 | 15±1 | 90±1 | 15±1 |
| Coverage | cm²/g | 65±5 | 61±5 | 70±5 | 71±5 | 63±5 | 58±5 | 58±5 | 15±5 | 47±5 |
--from Fraunhofer IKTS
The film parameters that can be achieved depend on the process conditions during processing (firing profile, solder materials, soldering
conditions, etc.), which are described in detail in the respective paste specification
